High functionaliy electric materials
TATSUTA provides wide range of functional paste such as via filing paste and circuitry paste which exhibits high connection reliability. Widely used for interlayer connection for high-speed data transmission PWBs , semiconductor substrates and printed electronics.See more details on the special webpage Inquiry for this product
Businesses Handling this Solution and Product
Semiconductor Materials Business
The keywords are "heat dissipation, heat resistance, and cost." We have a lineup of materials that support the improvement of thermal characteristics of transistors (IGBT) and other applications.